公海555000kk线路检测

During October 22-24, 2021, Beijing Microelectronics International Symposium and IC World Conference were held in Beijing YiChuang International Convention and Exhibition Center. GCLSemi had participated in the exhibition, which showcase 12- inches of our crystal segments and silicon wafers, which had attracted extensive coverage.

Our factory is committed to do research and development   of 12-inch silicon wafer production, directly cutting into 28nm and below wafer process nodes. We have two outstanding Research & Development centers, which are located in the United States and China, JiangSu XuZhou respectively. 

With the independent R & D and technical integration, we have continuously stabilizing and optimizing the manufacturing process. Our core competitiveness is the core patent technology “process” which we have mastered throughout in our state-of-the-art wafer factory. It includes cutting, grinding, polishing, cleaning, epitaxy, packaging, silicon wafer testing too.

At present, the perfect yield (COP Free) of each long crystal ingot has reached the international advanced level, and our pullers have made significant breakthrough in this industry. GCLSemi also has achieved the 12-inch wafer for customer qualifications and sales by more than twenty downstream customers. We have passed the qualification of few key customers in the United States and China Taiwan during the Q3 2021.

The conference mainly focused on the obstacles, blocking points and key points of this industry development. It had gathered international and domestic industry leaders and enterprise elites, and 113 exhibitors during the conference, most of them are involved in the fields of producing integrated circuit equipment, spare parts, factory equipment, wafer processed materials, Smart system of IC production and System interface consumables. During the exhibition, GCLSemi had in-depth exchanges and fruitful discussion with our key customers.